Control Processing

Overview of the Control Processing Laboratory

Overview of the Control Processing Laboratory By automating the machining of, for example, CPU substrates, it is possible to achieve machining accuracy and speed at levels which are inaccessible to any of the five human senses. This laboratory focuses on research related to ultra-high precision planarization machining of large-diameter semiconductor wafers (corrective polishing with oscillation speed control, development of polishing simulations, high-precision grinding and high-efficiency polishing), and actively engage in research related to the application of these techniques to areas such as highly precise planarization polishing and wrapping of rectangle glass materials, development of high-precision pin chucks for the flattening of large-size wafers, and micro fabrication using blasting technology.

Attractive aspects of control processing

Intriguing aspects of control processing - Leveling the ground of the Koshien Stadium with an error of 0.1 mm or less—this is the current manufacturing precision of industrial product factories. Realizing such precision levels, as well as the possibility to achieve even higher levels of precision and the subsequent wide-spread application of these technologies is what makes control processing a fascinating discipline. It is applied as an actual technique allowing for errors which are imperceptible to humans to be estimated with previously calculated wafer profile patterns using computational simulations. - We aim at performing research simulations which do not allow even the slightest error.